Routing vias in a substrate from bypass capacitor pads

ABSTRACT

A multilayer substrate having a bonding surface is disclosed. One embodiment of the substrate may comprise a bypass capacitor connection pad disposed on the bonding surface. The bypass capacitor connection pad may have a bypass capacitor power pad and a bypass capacitor ground pad. The substrate may also comprise a plurality of power vias routed from the bypass capacitor power pad to a first redistribution layer spaced apart from the bonding surface and a plurality of ground vias routed from the bypass capacitor ground pad to the first redistribution layer. The substrate may further comprise a plurality of power and ground vias routed from the first redistribution layer to a second redistribution layer according to a power and ground via pattern array, wherein the plurality of ground vias are jogged at the first redistribution layer to the plurality of power vias to form the power and ground via pattern array.

RELATED APPLICATION

This application is a divisional of U.S. patent application Ser. No.10/940,100, filed Sep. 14, 2004 now U.S. Pat. No. 7,075,185.

BACKGROUND

Electronic systems typically employ several different types ofelectrical interconnecting apparatus having planar layers ofelectrically conductive material separated by dielectric layers. Some ofthe conductive layers may be patterned to form electrically conductivesignal lines or “traces” to different layers to provide electricalcontacts between signals, power and ground terminals. For example,integrated circuits typically have several layers of conductive traceswhich interconnect electronic devices formed upon and within asemiconductor substrate. Additionally, these electrical traces may beused to electrically connect to pins or leads of the integratedcircuits. These pins and leads may then be coupled to a multi-layerceramic substrate or device package that provide intermediate routingfrom the integrated circuit pins to terminals of a printed circuit board(PCB). The PCB also typically includes several layers of conductivetraces separated by dielectric layers. The conductive traces are used toelectrically interconnect terminals of electronic devices mounted uponthe PCB.

Signal frequencies of digital electronic systems are continuallyincreasing. In multi-layer structures (e.g., printed wire boards,ceramic substrates, and/or semiconductor structures), the influence ofinductance, capacitance and resistance of different physical layers ofthe die and package have significant effects on the integrity of thedigital electronic system as frequencies increase. The effects caninclude including signal degradation due to reflections, power supply“droop”, ground “bounce”, and increased electromagnetic emissions. Onetechnique for mitigating power supply droop is the placement of “bypass”or “decoupling” capacitors. The bypass capacitors have power and groundconnections that are coupled to the power and ground connections of thedie through vias that are routed through the package (e.g., multilayerceramic (MLC) substrate, printed circuit board (PCB).

As power supply voltages continue to decrease and chip speeds continueto increase, the inductance associated with power and ground loops dueto the routing of power and ground signals from the package to the diebecomes increasingly problematic. Additionally, as power supply voltages(e.g., integrated circuit power supply voltages) become more sensitiveto inductance associated with coupling the power supply voltages tocircuit components, the inductance associated with coupling bypasscapacitors to the power supply voltage becomes more problematic.

SUMMARY

One embodiment of the present invention may comprise a method forrouting vias through a multilayer substrate having a plurality of layersextending between a first surface and a second surface. The method maycomprise arranging a bypass capacitor power pad spaced spaced apart froma bypass capacitor ground pad on the first surface, routing a pluralityof power vias from the bypass capacitor power pad to a firstredistribution layer spaced from the first surface, and routing aplurality of ground vias from the bypass capacitor ground pad to thefirst redistribution layer. The methodology may further comprise joggingthe plurality of ground vias at the first redistribution layer to theplurality of power vias to provide a power and ground via pattern, androuting the power and ground vias from the first redistribution layer toa second redistribution layer spaced apart from the first redistributionlayer based on the power and ground via pattern.

Another embodiment may comprise a multilayer substrate having a bondingsurface. The substrate may comprise a bypass capacitor connection paddisposed on the bonding surface. The bypass capacitor connection pad mayinclude a bypass capacitor power pad and a bypass capacitor ground pad.The substrate may further comprise a plurality of power vias routed fromthe bypass capacitor power pad to a first redistribution layer spacedapart from the bonding surface, and a plurality of ground vias routedfrom the bypass capacitor ground pad to the first redistribution layer.The substrate may also comprise a plurality of power and ground viasrouted from the first redistribution layer to a second redistributionlayer according to a power and ground via pattern array. The pluralityof ground vias may be jogged at the first redistribution layer to theplurality of power vias to form the power and ground via pattern array.

Yet another embodiment may comprise a multilayer substrate having abonding surface. The substrate may comprise a bypass capacitor multipleconnection pad disposed on the bonding surface. The bypass capacitormultiple connection pad may have an interleaved pattern of a bypasscapacitor power pads and bypass capacitor ground pads both at a firstside and a second side of the bypass capacitor multiple connection pad.The substrate may further comprise a power via column, associated witheach of the plurality of bypass capacitor power pads, that extends fromthe bonding surface to a first redistribution layer spaced apart fromthe bonding surface, and a ground via column, associated with each ofthe plurality of bypass capacitor ground pads, that extends from thebonding surface to the first redistribution layer. The substrate mayfurther comprise a plurality of power and ground vias routed from thefirst redistribution layer to a second redistribution layer that isspaced apart from the first redistribution layer according to a powerand ground via pattern array, wherein the ground via columns are joggedat the first redistribution layer to a location adjacent a first side ofa respective power via column to provide the power and ground viapattern array.

Still yet another embodiment may comprise a multilayer substrate havinga having a first surface and a second surface. The substrate maycomprise a bypass capacitor connection pad disposed on the firstsurface. The bypass capacitor connection pad may have a bypass capacitorpower pad and a bypass capacitor ground pad. The substrate may comprisea plurality of power vias that extend from the bypass capacitor powerpad to a first internal layer, and a plurality of ground vias thatextend from the first surface to the first internal layer wherein theplurality of ground vias may be interleaved with a plurality of groundplated through holes (PTHs) disposed on the first internal layer. Afirst conductive line may couple the plurality of ground vias at thefirst surface to the bypass capacitor ground pad, and a secondconductive line may couple the plurality of ground vias to the pluralityof ground PTHs. A plurality of additional conductive lines may couplethe plurality of power vias to a plurality of power PTHs by jogging thepower vias to the plurality of power PTHs.

Another embodiment may comprise a method for routing vias through amultilayer substrate having a first surface and a second surface. Themethod may comprise arranging a bypass capacitor power pad spaced apartfrom a bypass capacitor ground pad on the first surface, routing aplurality of power vias from the bypass capacitor power pad to a firstinternal layer and coupling a plurality of ground vias to the bypasscapacitor ground pad. The plurality of ground vias may be located on thebonding surface disposed above a plurality of ground plated throughholes (PTHs) disposed on the first internal layer. The methodology mayfurther comprise routing the plurality of ground vias to the firstinternal layer, coupling the plurality of ground vias to the pluralityof ground PTHs via a conductive line, and coupling the plurality ofpower vias to a plurality of power PTHs by jogging the power vias to theplurality of power PTHs employing respective conductive lines.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a cross-sectional view of an embodiment of a portionof a multilayer substrate having having a bypass capacitor power andground via pattern.

FIG. 2 illustrates an embodiment of a power and ground pad via patternassociated with a bypass capacitor connection pad.

FIG. 3 illustrates an embodiment of a power and ground via pattern at afirst redistribution layer associated with the power and ground pad viapatterns of FIG. 2.

FIG. 4 illustrates another embodiment of power and ground pad viapatterns associated with a bypass capacitor connection pad.

FIG. 5 illustrates another embodiment of power and ground via patternsat a first redistribution layer associated with the power and ground padvia patterns of FIG. 4.

FIG. 6 illustrates yet another embodiment of power and ground pad viapatterns associated with a bypass capacitor connection pad.

FIG. 7 illustrates yet another embodiment of power and ground viapatterns at a first redistribution layer associated with the power andground pad via patterns at the internal bond surface of FIG. 6.

FIG. 8 illustrates an embodiment of a bypass capacitor connection padassociated with a bonding or ground layer of a substrate.

FIG. 9 illustrates an embodiment of power and ground via patterns at asecond layer disposed internal to the bonding layer of FIG. 8.

FIG. 10 illustrates an embodiment of power and ground PTH patternsdisposed on a third layer internal to the second layer of FIG. 9.

FIG. 11 illustrates an embodiment of a methodology for routing viasthrough a multilayer substrate having a plurality of layers extendingbetween a first surface and a second surface.

FIG. 12 illustrates yet another embodiment of a methodology for routingvias through a multilayer substrate having a plurality of layersextending between a first surface and a second surface.

DETAILED DESCRIPTION

This disclosure relates generally to routing power and ground vias frombypass or package capacitors through a multilayer substrate (e.g., MLCsubstrate, PCB). The power and ground vias can provide couplingconnections from power and ground pads associated with a bypasscapacitor to power and ground connections of an integrated circuit ordie. The power and ground vias are routed based on power and ground viapatterns that reduce inductance associated with power and ground loopsthrough the multilayer substrate. The bypass capacitor types caninclude, for example, Low Inductance Chip Capacitors (LICCs), MultilayerCeramic Capacitors (MLCs), Low Inductance Capacitor Arrays (LICAs), andInter Digitated Capacitors (IDCs) and other capacitor types of varyingcharacteristics.

A “redistribution layer” as used in this disclosure refers to a layer inwhich the vias can be jogged and/or grouped together employingconductive lines, so that the vias can be moved to other locations onthe redistribution layer, or so that the number of vias can be reduced.A redistribution layer is typically a power layer, a ground layer or asignal layer. “Jogging” as used in this disclosure refers to a via thatincludes a bend or transition that is substantially transverse to thevia direction between layers. For example, a vertical metal via thatprovides interconnections between layers is typically joggedhorizontally along a “redistribution layer” to a location spaced fromthe vertical metal via. A new via is provided which then can continuevertically to one or more additional layers spaced below theredistribution layer, or the via can be grouped together with one ormore other vias to reduce the number of vias for routing to additionallayers.

FIG. 1 illustrates a cross-sectional view of a portion of a multilayersubstrate 10 having a first bypass capacitor power and ground viapattern. The multilayer substrate 10 can be a multilayer ceramicsubstrate, printed circuit board, semiconductor structure, or othermultilayer structure for routing signals therethrough. The multilayersubstrate 10 includes a plurality of redistribution layers (GND1, PWR1,GND2, PWR2) such as power layers, ground layers and signal layers (notshown). A redistribution layer is a layer in which vias areredistributed employing one or more conductive lines. The plurality ofpower layers, ground layers and signal layers can be interposed betweenone or more dielectric layers 12. The multilayer substrate 10 includesan internal bond surface 14 having a plurality of bypass capacitor bondpads (18, 20, 24, 26) for bonding bypass capacitors (22, 28) to themultilayer substrate 10. The multilayer substrate 10 can also includebond pads (not shown) for coupling to pins of an integrated circuitassociated with a circuit die. The multilayer substrate 10 also includesan external bond surface 16 having a plurality of external bond pads(not shown) for coupling the substrate to a printed circuit board orother multilayer device. The external bond pads can be a ball grid array(BGA), a pin grid array (PGA) or land grid array (LGA). A plurality ofbypass capacitors (22, 28) are coupled to the internal bond surface 14,for example, around the perimeter of the internal bond surface 14.

For illustrative purposes, the multilayer substrate 10 includes a firstground layer (GND1), a first power layer (PWR1), a second ground layer(GND2), and a second power layer (PWR2). A first bypass capacitor 22 anda second bypass capacitor 28 are coupled to the internal bond surface 14of the multilayer substrate 10. The first bypass capacitor 22 isassociated with a first power supply and the first power layer, and thesecond bypass capacitor 28 is associated with a second power supply andthe second power layer. A plurality of ground vias (G) extend from aground pad 18 of the first capacitor 22, and a plurality of power vias(P) extend from a power pad 20 associated with the first capacitor 22. Aplurality of ground vias (G) extend from a ground pad 24 of the secondcapacitor 28, and a plurality of power vias (P) extend from a power pad26 associated with the second capacitor 28.

At the first ground layer, the ground vias are redistributed employing aplurality of conductive lines. The ground vias associated with the firstbypass capacitor 22 are jogged from beneath the ground pad 18 to beneaththe power pad 20 at the first ground layer to form an interleaving powerand ground via pattern 25. The interleaving power and ground via pattern25 extends to the first power layer where the power vias associated withthe first bypass capacitor 22 are redistributed, and eventually routedto power bond pads (not shown) associated with power connections of anintegrated circuit or die. The ground vias associated with the secondbypass capacitor 28 are jogged from beneath the ground pad 24 to beneaththe power pad 26 at the first ground layer to form an interleaving powerand ground via pattern 27. The interleaving power and ground via pattern27 extends to the second power layer where the power vias associatedwith the second bypass capacitor 28 are redistributed, and eventuallyrouted to power bond pads (not shown) associated with power connectionsof an integrated circuit or die.

The redistribution of the power and ground vias also serve to mitigatevia bulge at the top surface (internal bond surface) of the multilayersubstrates. Via bulge is caused by the difference inexpansion/contraction of the typical conductive paste and the typicaldielectric material encompassing the vias and etch lines during firing.Therefore, vias which protrude from the surface and that go into thesubstrate through many layers will tend to form hills on the carrier'smounting surface, and will produce via-bulge. Accordingly, vias arejogged every six to eight layers to mitigate via bulge. Once the powervias are redistributed at respective power layers, the power and groundsignals can be routed through the multilayer substrate 10 to internalpower and ground connections associated with an integrated circuit ordie.

FIG. 2 illustrates an example of power and ground pad via patternsassociated with a bypass capacitor connection pad 30. The bypasscapacitor connection pad 30 includes a bypass capacitor power pad 32 anda bypass capacitor ground pad 34 residing on a portion of an internalbond surface 36 of a multilayer substrate. The bypass capacitor powerpad 32 and the bypass capacitor ground pad 34 are operative for couplingto a Low Inductance Chip Capacitor (LICC), or other capacitor typehaving a single power and a single ground bypass capacitor connectionpad. The bypass capacitor power pad 32 has a power via pattern 33 thatincludes four columns of power via pairs. Every via pair is offset froman adjacent via pair, with every other via pair having aligned rows.Therefore, space is available between power vias of the power via pairfor routing ground vias in a redistribution layer. The bypass capacitorground pad 34 has a ground via pattern 35 that includes four columns ofground via pairs. Every ground via pair is offset from an adjacentground via pair, with every other ground via pair having aligned rows.The ground via pattern 35 associated with the bypass capacitor groundpad 34 is similar to the power via pattern 33 associated with the bypasscapacitor power pad 32.

FIG. 3 illustrates a power and ground via pattern 40 at a firstredistribution layer associated with the power and ground pad viapatterns 33 and 35 of FIG. 2. The power and ground via pattern 40 canreside at a location below the bypass capacitor power pad 32 afterjogging of the ground vias at the first redistribution layer (e.g., thefirst ground layer as illustrated in FIG. 1). The power and ground viapattern 40 can extend from the first redistribution layer (e.g., aground layer (GND1, GND2)) space apart from the internal bond surface 36to a second redistribution layer (e.g., a power layer (PWR1, PWR2)),which is a layer between the first redistribution layer and an externalbond surface on an opposite side of the internal bond surface 36associated with the multilayer substrate. The power and ground viapattern 40 includes interleaving ground vias between power vias at thefirst redistribution layer 36 and extending the power ground via pattern40 through the multilayer substrate to a second redistribution layer.

The ground vias can be spaced apart in columns from the power vias at adistance that is substantially equal to the minimum pitch associatedwith the multilayer substrate. The minimum pitch is the minimum distancerequired between vias based on the requirements associated with a givenmultilayer substrate. The placement of ground vias around the power viasat a distance that is substantially equal to the minimum pitch minimizesthe inductance between the power and ground vias, thus mitigatingdeleterious effects associated with power and ground loops caused byrouting power and ground signals through the multilayer substrate. Theground vias can be spaced apart in rows from the power vias at adistance that is substantially equal to twice the minimum pitchassociated with the multilayer substrate. Therefore, area is providedfor routing the ground conductive lines to the ground vias from beneaththe bypass capacitor ground pad 34 to beneath the bypass capacitor powerpad 32 at the first redistribution layer. It is to be appreciated thatthe rows and columns can be interchanged if desired, such that theminimum pitch can be provided between power and ground vias in rows andtwice the minimum pitch can provided between power and ground vias incolumns.

FIG. 4 illustrates another example of power and ground pad via patternsassociated with a bypass capacitor connection pad 50. The bypasscapacitor connection pad 50 includes a bypass capacitor power pad 52 anda bypass capacitor ground pad 54 residing on a portion of an internalbond surface 56 of a multilayer substrate. The power and ground pads areoperative for coupling to a LICC, or other capacitor type having asingle power and a single ground bypass capacitor connection pad. Thebypass capacitor power pad 52 has a power via pattern 53 that includesfive columns of power via pairs. A first power via associated with eachpower via pair is aligned along a first row and a second power viaassociated with each power via pair is aligned along a second row. Thebypass capacitor ground pad 54 has a ground via pattern 55 that includesfour columns of ground via pairs. A first ground via associated witheach ground via pair is aligned along a first row and a second groundvia associated with each ground via pair is aligned along a second row.The ground via pattern 55 includes ground via columns that are offsetfrom power via columns of the power via pattern 53, for example, by adistance substantially equal to the minimum pitch associated with themultilayer substrate, such that columns of ground vias are aligned alonga plane that is between planes in which the power vias are aligned,wherein each plane is substantially transverse with the internal bondsurface 56.

FIG. 5 illustrates power and ground via patterns 62 and 64 at a firstredistribution layer 66 associated with the power and ground pad viapatterns 53 and 55 of FIG. 4. The dashed lines provide an indication ofthe location of the power pad 52 that overlies a first power and groundvia pattern 62, and the ground pad 54 that overlies the second power andground via pattern 64 at the internal bond surface 56. In the power andground via pattern 62, columns of ground vias associated with the groundpad via pattern 55 are jogged to a location between respective columnsof power vias associated with the power pad via pattern 53 at the firstredistribution layer 66, such as a first ground layer. In the power andground via pattern 64, columns of power vias associated with the powerpad via pattern 53 are jogged to a location between respective columnsof ground vias associated with the ground pad via pattern 55 at thefirst redistribution layer 66. Therefore, both the power and ground viapattern 62 below the bypass capacitor power pad 52 and the power andground via pattern 64 below the bypass capacitor ground pad 54 havesimilar power and ground via patterns with interleaving columns of powerand ground via pairs. The power and ground via pairs can be separated bya distance that is substantially equal to the minimum pitch associatedwith the substrate 50. The placement of ground vias around the powervias at a distance that is substantially equal to the minimum pitchminimizes the inductance between the power and ground vias, thusmitigating deleterious effects associated with power and ground loopscaused by routing power and ground signals through the multilayersubstrate to a respective die.

FIG. 6 illustrates yet another example of power and ground pad viapatterns associated with a bypass capacitor connection pad 70. Thebypass capacitor connection pad 70 has a plurality of power pads (72,76, 82, 86) and a plurality of ground pads (74, 78, 80, 84) residing ona portion of an internal bond surface 88 of a multilayer substrate. Thepower and ground pads are operative for coupling, for example, to anInter Digitated Capacitor (IDC), or other capacitor type with multiplepower pads and ground pads. In the illustrated example, the bypasscapacitor connection pad 70 includes four power pads (72, 76, 82, 86)and four ground pads (74, 78, 80, 84). The power pads (72, 76) andground pads (74, 78) are interleaved on a first side of the bypasscapacitor connection pad 70, and the power pads (82, 84) and ground pads(80, 84) are interleaved on a second side of the bypass capacitorconnection pad 70. The first side of the bypass capacitor connection pad70 includes a first power pad 72, adjacent a first ground pad 74,adjacent a second power pad 76, which is adjacent a second ground pad78. The second side of the bypass capacitor connection pad 70 includes athird ground pad 80, adjacent a third power pad 82, adjacent a fourthground pad 84, which is adjacent a fourth power pad 86. Each of thepower pads includes a column of three power vias, and each of the groundpads includes a column of three vias. It is to be appreciated that othercapacitor types with multiple power and ground connection pad patternscould include more or less power and ground connection pads and/or moreor less vias per power and/or ground connection pads.

FIG. 7 illustrates power and ground via patterns at a firstredistribution layer 90 associated with the power and ground pad viapatterns at the internal bond surface 88 of FIG. 6. The dashed linesprovide an indication of the location of the power pads (72, 76, 82, 86)and ground pads (74, 78, 80, 84) at the internal bond surface 88 thatoverly the first redistribution layer 90. In the power and ground viapatterns, columns of ground vias are jogged to a location adjacent afirst side of a respective columns of power vias and an additionalcolumn of ground vias are added adjacent a second side of the respectivecolumns of power vias at the first redistribution layer 90, such as afirst ground layer. This provides for each column of power vias to bedisposed between a pair of adjacent ground via columns.

As illustrated in FIG. 7, a column of ground vias 124 associated withthe first ground pad 74 are jogged to provide a column of ground vias 96located adjacent a first side of the column of power vias 94 associatedwith the first power pad 72. An additional column of ground vias 92 arethen provided adjacent a second side of the column of power vias 94associated with the first power pad 72. The column of power vias 94 andthe columns of ground vias 92 and 96 form a power and ground via pattern116 that extends from the first redistribution layer 90 to a secondredistribution layer, such as a power layer. The column of ground vias92 can be spaced apart from the column of power vias 94 by a distancesubstantially equal to the minimum pitch associated with the multilayersubstrate. Additionally, the column of ground vias 96 can be spacedapart from the column of power vias 94 by a distance substantially equalto the minimum pitch associated with the multilayer substrate.

A column of ground vias 126 associated with the second ground pad 78 arejogged to provide a column of ground vias 102 located adjacent a firstside of the column of power vias 100 associated with the second powerpad 76. An additional column of ground vias 98 are then providedadjacent a second side of the column of power vias 100 associated withthe second power pad 76. The column of power vias 100 and the columns ofground vias 98 and 102 form a power and ground via pattern 118 thatextends from the first redistribution layer 90 to a secondredistribution layer. The column of ground vias 98 can be spaced apartfrom the column of power vias 100 by a distance substantially equal tothe minimum pitch associated with the multilayer substrate.Additionally, the column of ground vias 102 can be spaced apart from thecolumn of power vias 100 by a distance substantially equal to theminimum pitch associated with the multilayer substrate.

A column of ground vias 128 associated with the third ground pad 80 arejogged to provide a column of ground vias 104 located adjacent a firstside of the column of power vias 106 associated with the third power pad82. An additional column of ground vias 108 are then provided adjacent asecond side of the column of power vias 106 associated with the thirdpower pad 82. The column of power vias 106 and the columns of groundvias 104 and 108 form a power and ground via pattern 120 that extendsfrom the first redistribution layer 90 to a second redistribution layer,such as a power layer. The column of ground vias 104 can be spaced apartfrom the column of power vias 106 by a distance substantially equal tothe minimum pitch associated with the multilayer substrate.Additionally, the column of ground vias 108 can be spaced apart from thecolumn of power vias 106 by a distance substantially equal to theminimum pitch associated with the multilayer substrate.

A column of ground vias 130 associated with the fourth ground pad 84 arejogged to provide a column of ground vias 110 located adjacent a firstside of the column of power vias 112 associated with the fourth powerpad 86. An additional column of ground vias 114 are then providedadjacent a second side of the column of power vias 112 associated withthe fourth power pad 86. The column of power vias 112 and the columns ofground vias 110 and 114 form a power and ground via pattern 122 thatextends from the first redistribution layer 90 to a secondredistribution layer. The column of ground vias 110 can be spaced apartfrom the column of power vias 112 by a distance substantially equal tothe minimum pitch associated with the multilayer substrate.Additionally, the column of ground vias 114 can be spaced apart from thecolumn of power vias 112 by a distance substantially equal to theminimum pitch associated with the multilayer substrate.

The power and ground via patterns 116, 118, 120 and 122 include fourarrays of power columns disposed between ground columns. The placementof the power vias in between the power vias reduces the inductanceassociated with the power and ground loops caused by routing of powerand ground signals through the multilayer substrate. The ground vias canbe disposed around the power vias at a distance that is substantiallyequal to the minimum pitch to further minimize the inductance betweenthe power and ground vias, thus mitigating deleterious effectsassociated with power and ground loops caused by routing power andground signals through the multilayer substrate to a respective die.

FIGS. 8-10 illustrate bypass capacitor power and ground pad via patternsassociated with three layers of a PCB. The bypass capacitor power andground pad via patterns can be repeated on both a first side and asecond opposing side of a PCB. FIG. 8 illustrates a bypass capacitorconnection pad 140 associated with a bonding or ground layer 150 of aPCB. A PCB can have a bonding layer or ground layer on a first side ofthe PCB, and a bonding or ground layer on a second side of the PCB. Thebypass capacitor connection pad 140 includes a bypass capacitor powerpad 142 and a bypass capacitor ground pad 144 for coupling to differentterminals of a bypass capacitor, such as a LICC. The bypass capacitorpower pad 142 includes a plurality of power microvias 143 arranged in asingle row. A row of ground microvias 148 are formed off the bypasscapacitor ground pad 144. The row of ground microvias 148 are coupled tothe bypass capacitor ground pad 144 by jogging a conductive line 146 torespective ground microvias in the row of ground microvias 148. In thepresent example, the row of ground microvias 148 includes a row of threeground microvias. The row of ground microvias 148 are disposed above aplurality of ground plated through holes (PTHs) in a power layer 174(FIG. 9) disposed beneath the bonding or ground layer 150.

FIG. 9 illustrates power and ground via patterns 160 at a second layer174 disposed internal to the bonding layer 150. The second layer 174 canbe a power layer associated with the PCB. The power layer can resideinternal to the bonding or ground layer 150. A PCB can have a powerlayer on a first side of the PCB, and a power layer on a second side ofthe PCB. The power microvias 143 from the bonding or ground layer 150extend to the second layer 174, and the ground vias 148 from the bondingor ground layer 150 extend to the second layer 174. The second layer 174includes a set of power PTHs 168, and a set of ground PTHs 170. Aconductive line 162 couples the power microvias 143 together. Aplurality of conductive lines 164 couple the power microvias 143 to thepower PTHs 168. A conductive line 172 couples the ground microvias 148to the ground PTHs 170.

FIG. 10 illustrates power and ground PTH patterns 180 disposed on athird layer 190 of the PCB. The third layer 190 is disposed internal tothe second layer 174 of the PCB. The third layer 190 can be a secondground layer associated with the PCB. The second ground layer can resideinternal to the bond layer 150, and the second layer 174. A PCB can havea second ground layer on a first side of the PCB, and a second groundlayer on a second side of the PCB. The third layer 190 includes a PTHpattern with a row 182 of power PTHs 184, and a row 186 of ground PTHs188. A respective power PTH 184 is aligned in a column with a respectiveground PTH 188, such that each power PTH 184 is aligned alongside aground PTH 188. The power PTHs 184 can be separated by the ground PTHsby the minimum allowable routing pitch of PTHs associated with themultilayer substrate. The power and ground PTHs associated with thesecond ground layer 190 can be coupled to power PTHs and ground PTHs ona second ground layer on an opposing side of the PCB, such that theinductance between the power and ground vias is minimized, thusmitigating deleterious effects associated with power and ground loopscaused by routing power and ground signals through the PCB. The secondside of the PCB can also include layers and connections as illustratedin FIGS. 8-10, such that bypass capacitors on both sides of the PCB canbe coupled to power and ground microvias and PTHs in a similar manner.

In view of the foregoing structural and functional features describedabove, certain methods will be better appreciated with reference toFIGS. 11-12. It is to be understood and appreciated that the illustratedactions, in other embodiments, may occur in different orders and/orconcurrently with other actions. Moreover, not all illustrated featuresmay be required to implement a method.

FIG. 11 illustrates a methodology for routing vias through a multilayersubstrate having a plurality of layers extending between a first surfaceand a second surface. At 200, a bypass capacitor power pad arrangedspaced apart from a bypass capacitor ground pad on the first surface. At210, a plurality of power vias are routed from the bypass capacitorpower pad to a first redistribution layer spaced from the first surface.At 220, a plurality of ground vias are routed from the bypass capacitorground pad to the first redistribution layer. At 230, the plurality ofground vias are jogged at the first redistribution layer to provide apower and ground via pattern. At 240, the power and ground vias arerouted from the first redistribution layer to a second redistributionlayer spaced apart from the first redistribution layer based on thepower and ground via pattern.

FIG. 12 illustrates another methodology for routing vias through amultilayer substrate having a plurality of layers extending between afirst surface and a second surface. At 300, a bypass capacitor power padspaced is arranged spaced apart from a bypass capacitor ground pad onthe first surface. At 310, a plurality of power vias are routed from thebypass capacitor power pad to a first internal layer. At 320, aplurality of ground vias are coupled to the bypass capacitor ground pad.The plurality of ground vias can be located on the bonding surfacedisposed above a plurality of ground plated through holes (PTHs)disposed on the first internal layer. At 330, the plurality of groundvias are routed to the first internal layer. At 340, the plurality ofground vias are coupled to the plurality of ground PTHs via a conductiveline. At 350, the plurality of power vias are coupled to a plurality ofpower PTHs by jogging the power vias to the plurality of power PTHsemploying respective conductive lines.

What have been described above are examples of the present invention. Itis, of course, not possible to describe every conceivable combination ofcomponents or methodologies for purposes of describing the presentinvention, but one of ordinary skill in the art will recognize that manyfurther combinations and permutations of the present invention arepossible. Accordingly, the present invention is intended to embrace allsuch alterations, modifications and variations that fall within thespirit and scope of the appended claims.

1. A multilayer substrate having a bonding surface, the substrate comprising: a bypass capacitor connection pad disposed on the bonding surface, the bypass capacitor connection pad having a bypass capacitor power pad and a bypass capacitor ground pad; a plurality of power vias routed from the bypass capacitor power pad to a first redistribution layer spaced apart from the bonding surface; a plurality of ground vias routed from the bypass capacitor ground pad to the first redistribution layer; and a plurality of power and ground vias routed from the first redistribution layer to a second redistribution layer according to a power and ground via pattern array, wherein the plurality of ground vias are jogged at the first redistribution layer to the plurality of power vias to form the power and ground via pattern array.
 2. The substrate of claim 1, wherein the plurality of power vias are jogged at the first redistribution layer to the plurality of ground vias to form a second power and ground via pattern array.
 3. The substrate of claim 2, wherein the power and ground via pattern array and the second power and ground via pattern array are comprised of a plurality of power via columns interleaved with a plurality of ground via columns, such that each power via column is adjacent at least one ground via column.
 4. The substrate of claim 2, wherein the power and ground via pattern array resides at a location that is substantially beneath the bypass capacitor power pad and the second power and ground via pattern array resides at a location that is substantially beneath the bypass capacitor ground pad.
 5. The substrate of claim 1, wherein the power and ground via pattern array is comprised of columns and rows of interleaving power and ground vias, wherein each power via has at least two adjacent ground vias.
 6. The substrate of claim 1, wherein the power and ground via pattern array resides at a location that is substantially beneath the bypass capacitor power pad.
 7. The substrate of claim 1, wherein the power and ground via pattern array is comprised of a column of ground vias adjacent a first side of a column of power vias.
 8. The substrate of claim 7, wherein the power and ground via pattern array is further comprised of a second column of ground vias adjacent a second side of the column of power vias. 